MediaTek Dimensity 1100 vs Qualcomm Snapdragon 870

VS

MediaTek Dimensity 1100 Qualcomm Snapdragon 870

Kami membandingkan dua versi SoC telefon: 8 teras 2600MHz MediaTek Dimensity 1100 vs. 8 teras 3200MHz Qualcomm Snapdragon 870. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 1100 Kelebihan

Proses pembuatan yang lebih moden (6nm vs 7nm)

Qualcomm Snapdragon 870 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.3721 TFLOPS vs 0.9792 TFLOPS )

Lebar jalur memori yang lebih besar (44GB/s vs 34.1GB/s)

Tinggi Frekuensi (3200MHz vs 2600MHz)

Penggunaan kuasa lebih rendah (6W berbanding 10W)

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 1100

786669

Qualcomm Snapdragon 870 +3%

810488

Geekbench 6 Single Core

MediaTek Dimensity 1100

1107

Qualcomm Snapdragon 870 +3%

1151

Geekbench 6 Multi Core

MediaTek Dimensity 1100

3332

Qualcomm Snapdragon 870

3336

FP32 (float)

MediaTek Dimensity 1100

979

Qualcomm Snapdragon 870 +40%

1372

MediaTek Dimensity 1100

VS

Qualcomm Snapdragon 870

CPU

4x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

Seni bina

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

2600 MHz

Frekuensi

3200 MHz

8

Teras

8

320 KB

Cache L2

1 MB

0

Cache L3

0

6 nm

Proses

7 nm

-

Bilangan transistor

10.3

10 W

TDP

6 W

TSMC

Pembuatan

TSMC

Grafik

Mali-G77 MP9

Nama GPU

Adreno 650

850 MHz

Frekuensi GPU

670 MHz

9

Unit pelaksanaan

2

64

Unit pewarnaan

512

16

Saiz maks

16

0.9792 TFLOPS

FLOPS

1.3721 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR5

2133 MHz

Frekuensi memori

2750 MHz

4x 16 Bit

Bas

4x 16 Bit

34.1 Gbit/s

Lebar jalur maks

44 Gbit/s

AI

MediaTek APU 3.0

Pemproses neural (NPU)

Hexagon 698

Multimedia (ISP)

MediaTek APU 3.0

Pemproses neural (NPU)

Hexagon 698

UFS 3.1

Jenis storan

UFS 3.0, UFS 3.1

2520 x 1080

Resolusi paparan maks

3840 x 2160

1x 108MP, 2x 32MP

Resolusi kamera maks

1x 200MP, 2x 25MP

4K at 60FPS

Rakaman video

8K at 30FPS, 4K at 60FPS

4K at 60FPS

Main balik video

8K at 30FPS, 4K at 60FPS

H.264, H.265, AV1, VP9

Codec video

H.264, H.265, VP8, VP9

AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

Helio M70

Modem

X55

Kesambungan

LTE Cat. 19

Sokongan 4G

LTE Cat. 22

Yes

Sokongan 5G

Yes

Up to 4700 Mbps

Kelajuan muat turun

Up to 7500 Mbps

Up to 2500 Mbps

Kelajuan muat naik

Up to 3000 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Jan 2021

Diumumkan

Jan 2021

Flagship

Kelas

Flagship

MT6891Z/CZA

Nombor model

SM8250-AC

MediaTek Dimensity 1100

Halaman rasmi

Qualcomm Snapdragon 870

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