MediaTek Dimensity 8400 vs HiSilicon Kirin 970

VS

MediaTek Dimensity 8400

HiSilicon Kirin 970

We compared two versions of phone SoCs: 8 cores 3250MHz MediaTek Dimensity 8400 vs. 8 cores 2360MHz HiSilicon Kirin 970 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

MediaTek Dimensity 8400 Advantages

Larger memory bandwidth (136GB/s vs 29.8GB/s)

Higher Frequency (3250MHz vs 2360MHz)

More modern manufacturing process (4nm vs 10nm)

Released 7 years and 3 months late

Score

Benchmark

Geekbench 6 Single Core

MediaTek Dimensity 8400 +327%

1651

HiSilicon Kirin 970

386

Geekbench 6 Multi Core

MediaTek Dimensity 8400 +396%

6833

HiSilicon Kirin 970

1377

MediaTek Dimensity 8400

VS

HiSilicon Kirin 970

CPU

1x 3.25 GHz – Cortex-A725
3x 3.0 GHz – Cortex-A725
4x 2.1 GHz – Cortex-A725

Architecture

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

3250 MHz

Frequency

2360 MHz

8

Cores

8

ARMv9-A

Instruction set

ARMv8-A

3.5 MB

L2 cache

2 MB

6 MB

L3 cache

0

4 nm

Process

10 nm

-

Transistor count

5.5

-

TDP

9 W

TSMC

Manufacturing

TSMC

Graphics

Mali-G720 MC7

GPU name

Mali-G72 MP12

1400 MHz

GPU frequency

768 MHz

6

Execution units

12

-

Shading units

18

24

Max size

8

-

FLOPS

0.3318 TFLOPS

1.3

Vulkan version

1.3

2.0

OpenCL version

2.0

-

DirectX version

12

Memory

LPDDR5X

Memory type

LPDDR4X

8533 MHz

Memory frequency

1866 MHz

4x 16 Bit

Bus

4x 16 Bit

136 Gbit/s

Max bandwidth

29.8 Gbit/s

AI

MediaTek NPU 880

NPU

-

Multimedia (ISP)

MediaTek NPU 880

Neural processor (NPU)

Yes

UFS 4.0

Storage type

UFS 2.1

2960 x 1440

Max display resolution

3120 x 1440

1x 320MP

Max camera resolution

1x 48MP, 2x 20MP

4K at 60FPS

Video capture

4K at 30FPS

4K at 60FPS

Video playback

4K at 30FPS

H.264, H.265, AV1, VP9

Video codecs

H.264, H.265, VP8, VP9, VC-1

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Audio codecs

32 bit@384 kHz, HD-audio

Connectivity

-

4G support

LTE Cat. 18

Yes

5G support

No

Up to 7900 Mbps

Download speed

Up to 1200 Mbps

Up to 4200 Mbps

Upload speed

Up to 150 Mbps

6

Wi-Fi

5

5.4

Bluetooth

4.2

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo

Info

Dec 2024

Announced

Sep 2017

Flagship

Class

Flagship

-

Model number

Hi3670

MediaTek Dimensity 8400

Official page

HiSilicon Kirin 970

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