Qualcomm Snapdragon 778G Plus vs HiSilicon Kirin 810

VS

Qualcomm Snapdragon 778G Plus

HiSilicon Kirin 810

We compared two versions of phone SoCs: 8 cores 2500MHz Qualcomm Snapdragon 778G Plus vs. 8 cores 2270MHz HiSilicon Kirin 810 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 778G Plus Advantages

Better graphics card performance FLOPS (0.8448 TFLOPS vs 0.2362 TFLOPS )

Higher Frequency (2500MHz vs 2270MHz)

More modern manufacturing process (6nm vs 7nm)

Released 2 years and 4 months late

HiSilicon Kirin 810 Advantages

Larger memory bandwidth (31.78GB/s vs 25.6GB/s)

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 778G Plus +47%

616678

HiSilicon Kirin 810

418563

Geekbench 6 Single Core

Qualcomm Snapdragon 778G Plus +37%

1069

HiSilicon Kirin 810

778

Geekbench 6 Multi Core

Qualcomm Snapdragon 778G Plus +51%

3008

HiSilicon Kirin 810

1992

FP32 (float)

Qualcomm Snapdragon 778G Plus +257%

844

HiSilicon Kirin 810

236

Qualcomm Snapdragon 778G Plus

VS

HiSilicon Kirin 810

CPU

1x 2.5 GHz – Kryo 670 Prime (Cortex-A78)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)

Architecture

2x 2.27 GHz – Cortex-A76
6x 1.9 GHz – Cortex-A55

2500 MHz

Frequency

2270 MHz

8

Cores

8

ARMv8.4-A

Instruction set

ARMv8.2-A

2 MB

L2 cache

1 MB

6 nm

Process

7 nm

-

Transistor count

6.9

5 W

TDP

5 W

TSMC

Manufacturing

-

Graphics

Adreno 642

GPU name

Mali-G52 MP6

550 MHz

GPU frequency

820 MHz

2

Execution units

6

384

Shading units

24

16

Max size

8

0.8448 TFLOPS

FLOPS

0.2362 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR4X

3200 MHz

Memory frequency

2133 MHz

2x 16 Bit

Bus

4x 16 Bit

25.6 Gbit/s

Max bandwidth

31.78 Gbit/s

Multimedia (ISP)

Hexagon 770

Neural processor (NPU)

Yes

UFS 2.2, UFS 3.0, UFS 3.1

Storage type

eMMC 5.1, UFS 2.1

2520 x 1080

Max display resolution

3840 x 2160

1x 192MP

Max camera resolution

1x 48MP, 2x 20MP

4K at 30FPS

Video capture

1K at 30FPS

4K at 30FPS

Video playback

1080p at 60FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

AIFF, CAF, MP3, MP4, WAV

X53

Modem

-

Connectivity

LTE Cat. 24

4G support

LTE Cat. 12

Yes

5G support

No

Up to 3700 Mbps

Download speed

Up to 600 Mbps

Up to 1600 Mbps

Upload speed

Up to 150 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo

Info

Oct 2021

Announced

Jun 2019

Mid range

Class

Mid range

SM7325-AE

Model number

Hi6280

Qualcomm Snapdragon 778G Plus

Official page

HiSilicon Kirin 810

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