Qualcomm Snapdragon 870 vs MediaTek Dimensity 810

VS

Qualcomm Snapdragon 870 MediaTek Dimensity 810

We compared two versions of phone SoCs: 8 cores 3200MHz Qualcomm Snapdragon 870 vs. 8 cores 2400MHz MediaTek Dimensity 810 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 870 Advantages

Better graphics card performance FLOPS (1.3721 TFLOPS vs 0.243 TFLOPS )

Larger memory bandwidth (44GB/s vs 17.07GB/s)

Higher Frequency (3200MHz vs 2400MHz)

MediaTek Dimensity 810 Advantages

More modern manufacturing process (6nm vs 7nm)

Released 7 months late

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 870 +87%

810488

MediaTek Dimensity 810

433200

Geekbench 6 Single Core

Qualcomm Snapdragon 870 +46%

1151

MediaTek Dimensity 810

787

Geekbench 6 Multi Core

Qualcomm Snapdragon 870 +71%

3336

MediaTek Dimensity 810

1945

FP32 (float)

Qualcomm Snapdragon 870 +464%

1372

MediaTek Dimensity 810

243

Qualcomm Snapdragon 870

VS

MediaTek Dimensity 810

CPU

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

Architecture

2x 2.4 GHz – Cortex-A76
6x 2 GHz – Cortex-A55

3200 MHz

Frequency

2400 MHz

8

Cores

8

1 MB

L2 cache

1 MB

0

L3 cache

0

7 nm

Process

6 nm

10.3

Transistor count

12

6 W

TDP

6 W

TSMC

Manufacturing

TSMC

Graphics

Adreno 650

GPU name

Mali-G57 MP2

670 MHz

GPU frequency

950 MHz

2

Execution units

2

512

Shading units

64

16

Max size

16

1.3721 TFLOPS

FLOPS

0.243 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR4X

2750 MHz

Memory frequency

2133 MHz

4x 16 Bit

Bus

2x 16 Bit

44 Gbit/s

Max bandwidth

17.07 Gbit/s

AI

Hexagon 698

NPU

MediaTek APU 3.0

Multimedia (ISP)

Hexagon 698

Neural processor (NPU)

MediaTek APU 3.0

UFS 3.0, UFS 3.1

Storage type

UFS 2.2

3840 x 2160

Max display resolution

2520 x 1080

1x 200MP, 2x 25MP

Max camera resolution

1x 64MP, 2x 16MP

8K at 30FPS, 4K at 60FPS

Video capture

2K at 30FPS

8K at 30FPS, 4K at 60FPS

Video playback

2K at 30FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

X55

Modem

-

Connectivity

LTE Cat. 22

4G support

LTE Cat. 18

Yes

5G support

Yes

Up to 7500 Mbps

Download speed

Up to 2770 Mbps

Up to 3000 Mbps

Upload speed

Up to 1250 Mbps

6

Wi-Fi

5

5.2

Bluetooth

5.1

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Jan 2021

Announced

Aug 2021

Flagship

Class

Mid range

SM8250-AC

Model number

MT6833V

Qualcomm Snapdragon 870

Official page

MediaTek Dimensity 810

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