Qualcomm Snapdragon 870 vs MediaTek Dimensity 810

VS

Qualcomm Snapdragon 870

MediaTek Dimensity 810

Kami membandingkan dua versi SoC telefon: 8 teras 3200MHz Qualcomm Snapdragon 870 vs. 8 teras 2400MHz MediaTek Dimensity 810. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 870 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.3721 TFLOPS vs 0.243 TFLOPS )

Lebar jalur memori yang lebih besar (44GB/s vs 17.07GB/s)

Tinggi Frekuensi (3200MHz vs 2400MHz)

MediaTek Dimensity 810 Kelebihan

Proses pembuatan yang lebih moden (6nm vs 7nm)

Dikeluarkan lewat 7 bulan

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 870 +87%

810488

MediaTek Dimensity 810

433200

Geekbench 6 Single Core

Qualcomm Snapdragon 870 +46%

1151

MediaTek Dimensity 810

787

Geekbench 6 Multi Core

Qualcomm Snapdragon 870 +71%

3336

MediaTek Dimensity 810

1945

FP32 (float)

Qualcomm Snapdragon 870 +464%

1372

MediaTek Dimensity 810

243

Qualcomm Snapdragon 870

VS

MediaTek Dimensity 810

CPU

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

Seni bina

2x 2.4 GHz – Cortex-A76
6x 2 GHz – Cortex-A55

3200 MHz

Frekuensi

2400 MHz

8

Teras

8

ARMv8.2-A

Set arahan

ARMv8.2-A

1 MB

Cache L2

1 MB

0

Cache L3

0

7 nm

Proses

6 nm

10.3

Bilangan transistor

12

6 W

TDP

6 W

TSMC

Pembuatan

TSMC

Grafik

Adreno 650

Nama GPU

Mali-G57 MP2

670 MHz

Frekuensi GPU

950 MHz

2

Unit pelaksanaan

2

512

Unit pewarnaan

64

16

Saiz maks

16

1.3721 TFLOPS

FLOPS

0.243 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR4X

2750 MHz

Frekuensi memori

2133 MHz

4x 16 Bit

Bas

2x 16 Bit

44 Gbit/s

Lebar jalur maks

17.07 Gbit/s

Multimedia (ISP)

Hexagon 698

Pemproses neural (NPU)

MediaTek APU 3.0

UFS 3.0, UFS 3.1

Jenis storan

UFS 2.2

3840 x 2160

Resolusi paparan maks

2520 x 1080

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 64MP, 2x 16MP

8K at 30FPS, 4K at 60FPS

Rakaman video

2K at 30FPS

8K at 30FPS, 4K at 60FPS

Main balik video

2K at 30FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

X55

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 18

Yes

Sokongan 5G

Yes

Up to 7500 Mbps

Kelajuan muat turun

Up to 2770 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 1250 Mbps

6

Wi-Fi

5

5.2

Bluetooth

5.1

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Jan 2021

Diumumkan

Ogo 2021

Flagship

Kelas

Mid range

SM8250-AC

Nombor model

MT6833V

Qualcomm Snapdragon 870

Halaman rasmi

MediaTek Dimensity 810

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