Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 810

VS

Qualcomm Snapdragon 888 Plus HiSilicon Kirin 810

We compared two versions of phone SoCs: 8 cores 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 cores 2270MHz HiSilicon Kirin 810 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 888 Plus Advantages

Better graphics card performance FLOPS (1.8534 TFLOPS vs 0.2362 TFLOPS )

Larger memory bandwidth (51.2GB/s vs 31.78GB/s)

Higher Frequency (2995MHz vs 2270MHz)

More modern manufacturing process (5nm vs 7nm)

Released 2 years late

HiSilicon Kirin 810 Advantages

Lower TDP (5W vs 8W)

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 888 Plus +99%

836957

HiSilicon Kirin 810

418563

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +58%

1230

HiSilicon Kirin 810

778

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +89%

3778

HiSilicon Kirin 810

1992

FP32 (float)

Qualcomm Snapdragon 888 Plus +685%

1853

HiSilicon Kirin 810

236

Qualcomm Snapdragon 888 Plus

VS

HiSilicon Kirin 810

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Architecture

2x 2.27 GHz – Cortex-A76
6x 1.9 GHz – Cortex-A55

2995 MHz

Frequency

2270 MHz

8

Cores

8

1 MB

L2 cache

1 MB

0

L3 cache

-

5 nm

Process

7 nm

10.3

Transistor count

6.9

8 W

TDP

5 W

Samsung

Manufacturing

-

Graphics

Adreno 660

GPU name

Mali-G52 MP6

905 MHz

GPU frequency

820 MHz

2

Execution units

6

512

Shading units

24

Max size

8

1.8534 TFLOPS

FLOPS

0.2362 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR4X

3200 MHz

Memory frequency

2133 MHz

4x 16 Bit

Bus

4x 16 Bit

51.2 Gbit/s

Max bandwidth

31.78 Gbit/s

AI

Hexagon 780

NPU

Yes

Multimedia (ISP)

Hexagon 780

Neural processor (NPU)

Yes

UFS 3.0, UFS 3.1

Storage type

eMMC 5.1, UFS 2.1

3840 x 2160

Max display resolution

3840 x 2160

1x 200MP, 2x 25MP

Max camera resolution

1x 48MP, 2x 20MP

8K at 30FPS, 4K at 120FPS

Video capture

1K at 30FPS

8K at 30FPS

Video playback

1080p at 60FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

AIFF, CAF, MP3, MP4, WAV

X60

Modem

-

Connectivity

LTE Cat. 22

4G support

LTE Cat. 12

Yes

5G support

No

Up to 7500 Mbps

Download speed

Up to 600 Mbps

Up to 3000 Mbps

Upload speed

Up to 150 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo

Info

Jun 2021

Announced

Jun 2019

Flagship

Class

Mid range

SM8350-AC

Model number

Hi6280

Qualcomm Snapdragon 888 Plus

Official page

HiSilicon Kirin 810

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