Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 810

VS

Qualcomm Snapdragon 888 Plus HiSilicon Kirin 810

Kami membandingkan dua versi SoC telefon: 8 teras 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 teras 2270MHz HiSilicon Kirin 810. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 0.2362 TFLOPS )

Lebar jalur memori yang lebih besar (51.2GB/s vs 31.78GB/s)

Tinggi Frekuensi (2995MHz vs 2270MHz)

Proses pembuatan yang lebih moden (5nm vs 7nm)

Dikeluarkan lewat 2 tahun

HiSilicon Kirin 810 Kelebihan

Penggunaan kuasa lebih rendah (5W berbanding 8W)

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 888 Plus +99%

836957

HiSilicon Kirin 810

418563

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +58%

1230

HiSilicon Kirin 810

778

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +89%

3778

HiSilicon Kirin 810

1992

FP32 (float)

Qualcomm Snapdragon 888 Plus +685%

1853

HiSilicon Kirin 810

236

Qualcomm Snapdragon 888 Plus

VS

HiSilicon Kirin 810

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Seni bina

2x 2.27 GHz – Cortex-A76
6x 1.9 GHz – Cortex-A55

2995 MHz

Frekuensi

2270 MHz

8

Teras

8

1 MB

Cache L2

1 MB

0

Cache L3

-

5 nm

Proses

7 nm

10.3

Bilangan transistor

6.9

8 W

TDP

5 W

Samsung

Pembuatan

-

Grafik

Adreno 660

Nama GPU

Mali-G52 MP6

905 MHz

Frekuensi GPU

820 MHz

2

Unit pelaksanaan

6

512

Unit pewarnaan

24

Saiz maks

8

1.8534 TFLOPS

FLOPS

0.2362 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR4X

3200 MHz

Frekuensi memori

2133 MHz

4x 16 Bit

Bas

4x 16 Bit

51.2 Gbit/s

Lebar jalur maks

31.78 Gbit/s

AI

Hexagon 780

Pemproses neural (NPU)

Yes

Multimedia (ISP)

Hexagon 780

Pemproses neural (NPU)

Yes

UFS 3.0, UFS 3.1

Jenis storan

eMMC 5.1, UFS 2.1

3840 x 2160

Resolusi paparan maks

3840 x 2160

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 48MP, 2x 20MP

8K at 30FPS, 4K at 120FPS

Rakaman video

1K at 30FPS

8K at 30FPS

Main balik video

1080p at 60FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AIFF, CAF, MP3, MP4, WAV

X60

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 12

Yes

Sokongan 5G

No

Up to 7500 Mbps

Kelajuan muat turun

Up to 600 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 150 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo

Info

Jun 2021

Diumumkan

Jun 2019

Flagship

Kelas

Mid range

SM8350-AC

Nombor model

Hi6280

Qualcomm Snapdragon 888 Plus

Halaman rasmi

HiSilicon Kirin 810

Perbandingan SoC Berkaitan

1

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 8300

2

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 7 Gen 3

3

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 6 Gen 1

4

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 8 Gen 4

5

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 8 Gen 1

6

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 7300

7

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 7 Plus Gen 2

8

Qualcomm Snapdragon 7 Plus Gen 3 vs Qualcomm Snapdragon 888 Plus

9

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 9000 Plus

10

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 630