Qualcomm Snapdragon 888 Plus vs MediaTek Helio G70

VS

Qualcomm Snapdragon 888 Plus MediaTek Helio G70

We compared two versions of phone SoCs: 8 cores 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 cores 2000MHz MediaTek Helio G70 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 888 Plus Advantages

Better graphics card performance FLOPS (1.8534 TFLOPS vs 0.0787 TFLOPS )

Larger memory bandwidth (51.2GB/s vs 13.41GB/s)

Higher Frequency (2995MHz vs 2000MHz)

More modern manufacturing process (5nm vs 12nm)

Released 1 years and 5 months late

MediaTek Helio G70 Advantages

Lower TDP (5W vs 8W)

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 888 Plus +236%

836957

MediaTek Helio G70

249042

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +194%

1230

MediaTek Helio G70

418

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +180%

3778

MediaTek Helio G70

1347

FP32 (float)

Qualcomm Snapdragon 888 Plus +2275%

1853

MediaTek Helio G70

78

Qualcomm Snapdragon 888 Plus

VS

MediaTek Helio G70

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Architecture

2x 2 GHz – Cortex-A75
6x 1.7 GHz – Cortex-A55

2995 MHz

Frequency

2000 MHz

8

Cores

8

1 MB

L2 cache

320 KB

0

L3 cache

0

5 nm

Process

12 nm

10.3

Transistor count

5.5

8 W

TDP

5 W

Samsung

Manufacturing

TSMC

Graphics

Adreno 660

GPU name

Mali-G52 MP2

905 MHz

GPU frequency

820 MHz

2

Execution units

2

512

Shading units

24

Max size

8

1.8534 TFLOPS

FLOPS

0.0787 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR4X

3200 MHz

Memory frequency

1800 MHz

4x 16 Bit

Bus

2x 16 Bit

51.2 Gbit/s

Max bandwidth

13.41 Gbit/s

AI

Hexagon 780

NPU

Yes

Multimedia (ISP)

Hexagon 780

Neural processor (NPU)

Yes

UFS 3.0, UFS 3.1

Storage type

eMMC 5.1

3840 x 2160

Max display resolution

2520 x 1080

1x 200MP, 2x 25MP

Max camera resolution

1x 48MP, 2x 16MP

8K at 30FPS, 4K at 120FPS

Video capture

2K at 30FPS

8K at 30FPS

Video playback

2K at 30FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

AIFF, CAF, MP3, MP4, WAV

X60

Modem

-

Connectivity

LTE Cat. 22

4G support

LTE Cat. 7

Yes

5G support

No

Up to 7500 Mbps

Download speed

Up to 300 Mbps

Up to 3000 Mbps

Upload speed

Up to 100 Mbps

6

Wi-Fi

5

5.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo

Info

Jun 2021

Announced

Jan 2020

Flagship

Class

Mid range

SM8350-AC

Model number

MT6769V/CB

Qualcomm Snapdragon 888 Plus

Official page

MediaTek Helio G70

Related SoC Comparison

1

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 8300

2

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 7 Gen 3

3

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 6 Gen 1

4

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 8 Gen 4

5

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 8 Gen 1

6

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 7300

7

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 870

8

Qualcomm Snapdragon 7 Plus Gen 3 vs Qualcomm Snapdragon 888 Plus

9

Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 820

10

Qualcomm Snapdragon 888 Plus vs Samsung Exynos 9820