HiSilicon Kirin 970 vs Qualcomm Snapdragon 8 Gen 3

VS

HiSilicon Kirin 970

Qualcomm Snapdragon 8 Gen 3

Kami membandingkan dua versi SoC telefon: 8 teras 2360MHz HiSilicon Kirin 970 vs. 8 teras 3300MHz Qualcomm Snapdragon 8 Gen 3. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 8 Gen 3 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (4.7308 TFLOPS vs 0.3318 TFLOPS )

Lebar jalur memori yang lebih besar (77GB/s vs 29.8GB/s)

Tinggi Frekuensi (3300MHz vs 2360MHz)

Proses pembuatan yang lebih moden (4nm vs 10nm)

Dikeluarkan lewat 6 tahun dan 1 bulan

Skor

Penanda Aras

AnTuTu 10

HiSilicon Kirin 970

355946

Qualcomm Snapdragon 8 Gen 3 +484%

2079542

Geekbench 6 Single Core

HiSilicon Kirin 970

386

Qualcomm Snapdragon 8 Gen 3 +465%

2181

Geekbench 6 Multi Core

HiSilicon Kirin 970

1377

Qualcomm Snapdragon 8 Gen 3 +426%

7250

FP32 (float)

HiSilicon Kirin 970

331

Qualcomm Snapdragon 8 Gen 3 +1329%

4730

HiSilicon Kirin 970

VS

Qualcomm Snapdragon 8 Gen 3

CPU

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

Seni bina

1x 3.3 GHz – Cortex-X4
3x 3.15 GHz – Cortex-A720
2x 2.96 GHz – Cortex-A720
2x 2.26 GHz – Cortex-A520

2360 MHz

Frekuensi

3300 MHz

8

Teras

8

ARMv8-A

Set arahan

ARMv9.2-A

2 MB

Cache L2

-

0

Cache L3

0

10 nm

Proses

4 nm

5.5

Bilangan transistor

-

9 W

TDP

-

TSMC

Pembuatan

TSMC

Grafik

Mali-G72 MP12

Nama GPU

Adreno 750

768 MHz

Frekuensi GPU

903 MHz

12

Unit pelaksanaan

2

18

Unit pewarnaan

1536

8

Saiz maks

24

0.3318 TFLOPS

FLOPS

4.7308 TFLOPS

1.3

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR5X

1866 MHz

Frekuensi memori

4800 MHz

4x 16 Bit

Bas

4x 16 Bit

29.8 Gbit/s

Lebar jalur maks

77 Gbit/s

Multimedia (ISP)

Yes

Pemproses neural (NPU)

Hexagon

UFS 2.1

Jenis storan

UFS 4.0

3120 x 1440

Resolusi paparan maks

3840 x 2160

1x 48MP, 2x 20MP

Resolusi kamera maks

1x 200MP

4K at 30FPS

Rakaman video

8K at 30FPS, 4K at 120FPS

4K at 30FPS

Main balik video

8K at 60FPS, 4K at 120FPS

H.264, H.265, VP8, VP9, VC-1

Codec video

H.264, H.265, AV1, VP8, VP9

32 bit@384 kHz, HD-audio

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

Snapdragon X75

Kesambungan

LTE Cat. 18

Sokongan 4G

LTE Cat. 24

No

Sokongan 5G

Yes

Up to 1200 Mbps

Kelajuan muat turun

Up to 10000 Mbps

Up to 150 Mbps

Kelajuan muat naik

Up to 3500 Mbps

5

Wi-Fi

7

4.2

Bluetooth

5.4

GPS, GLONASS, Beidou, Galileo

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Sep 2017

Diumumkan

Okt 2023

Flagship

Kelas

Flagship

Hi3670

Nombor model

SM8650-AB

HiSilicon Kirin 970

Halaman rasmi

Qualcomm Snapdragon 8 Gen 3

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HiSilicon Kirin 970 vs Samsung Exynos 9810

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HiSilicon Kirin 970 vs MediaTek Dimensity 6020

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HiSilicon Kirin 970 vs MediaTek Dimensity 1000L