HiSilicon Kirin 970 vs Qualcomm Snapdragon 888 Plus

VS

HiSilicon Kirin 970 Qualcomm Snapdragon 888 Plus

Kami membandingkan dua versi SoC telefon: 8 teras 2360MHz HiSilicon Kirin 970 vs. 8 teras 2995MHz Qualcomm Snapdragon 888 Plus. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 0.3318 TFLOPS )

Lebar jalur memori yang lebih besar (51.2GB/s vs 29.8GB/s)

Tinggi Frekuensi (2995MHz vs 2360MHz)

Proses pembuatan yang lebih moden (5nm vs 10nm)

Penggunaan kuasa lebih rendah (8W berbanding 9W)

Dikeluarkan lewat 3 tahun dan 9 bulan

Skor

Penanda Aras

AnTuTu 10

HiSilicon Kirin 970

355946

Qualcomm Snapdragon 888 Plus +135%

836957

Geekbench 6 Single Core

HiSilicon Kirin 970

386

Qualcomm Snapdragon 888 Plus +218%

1230

Geekbench 6 Multi Core

HiSilicon Kirin 970

1377

Qualcomm Snapdragon 888 Plus +174%

3778

FP32 (float)

HiSilicon Kirin 970

331

Qualcomm Snapdragon 888 Plus +459%

1853

HiSilicon Kirin 970

VS

Qualcomm Snapdragon 888 Plus

CPU

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

Seni bina

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

2360 MHz

Frekuensi

2995 MHz

8

Teras

8

2 MB

Cache L2

1 MB

0

Cache L3

0

10 nm

Proses

5 nm

5.5

Bilangan transistor

10.3

9 W

TDP

8 W

TSMC

Pembuatan

Samsung

Grafik

Mali-G72 MP12

Nama GPU

Adreno 660

768 MHz

Frekuensi GPU

905 MHz

12

Unit pelaksanaan

2

18

Unit pewarnaan

512

8

Saiz maks

24

0.3318 TFLOPS

FLOPS

1.8534 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR5

1866 MHz

Frekuensi memori

3200 MHz

4x 16 Bit

Bas

4x 16 Bit

29.8 Gbit/s

Lebar jalur maks

51.2 Gbit/s

AI

Yes

Pemproses neural (NPU)

Hexagon 780

Multimedia (ISP)

Yes

Pemproses neural (NPU)

Hexagon 780

UFS 2.1

Jenis storan

UFS 3.0, UFS 3.1

3120 x 1440

Resolusi paparan maks

3840 x 2160

1x 48MP, 2x 20MP

Resolusi kamera maks

1x 200MP, 2x 25MP

4K at 30FPS

Rakaman video

8K at 30FPS, 4K at 120FPS

4K at 30FPS

Main balik video

8K at 30FPS

H.264, H.265, VP8, VP9, VC-1

Codec video

H.264, H.265, VP8, VP9

32 bit@384 kHz, HD-audio

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

X60

Kesambungan

LTE Cat. 18

Sokongan 4G

LTE Cat. 22

No

Sokongan 5G

Yes

Up to 1200 Mbps

Kelajuan muat turun

Up to 7500 Mbps

Up to 150 Mbps

Kelajuan muat naik

Up to 3000 Mbps

5

Wi-Fi

6

4.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Sep 2017

Diumumkan

Jun 2021

Flagship

Kelas

Flagship

Hi3670

Nombor model

SM8350-AC

HiSilicon Kirin 970

Halaman rasmi

Qualcomm Snapdragon 888 Plus

Perbandingan SoC Berkaitan

1

MediaTek Helio G99 vs HiSilicon Kirin 970

2

Samsung Exynos 2200 vs HiSilicon Kirin 970

3

HiSilicon Kirin 970 vs Qualcomm Snapdragon 6 Gen 1

4

Google Tensor G3 vs HiSilicon Kirin 970

5

Qualcomm Snapdragon 845 vs HiSilicon Kirin 970

6

HiSilicon Kirin 970 vs Qualcomm Snapdragon 720G

7

Qualcomm Snapdragon 7 Plus Gen 3 vs Qualcomm Snapdragon 888 Plus

8

Samsung Exynos 1480 vs Qualcomm Snapdragon 888 Plus

9

HiSilicon Kirin 970 vs MediaTek Dimensity 8300

10

HiSilicon Kirin 970 vs Samsung Exynos 1380