MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 860

VS

MediaTek Dimensity 1000 Plus

Qualcomm Snapdragon 860

Kami membandingkan dua versi SoC telefon: 8 teras 2600MHz MediaTek Dimensity 1000 Plus vs. 8 teras 2960MHz Qualcomm Snapdragon 860. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 1000 Plus Kelebihan

Dikeluarkan lewat 1 tahun dan 1 bulan

Qualcomm Snapdragon 860 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.0368 TFLOPS vs 0.9792 TFLOPS )

Lebar jalur memori yang lebih besar (34.13GB/s vs 29.87GB/s)

Tinggi Frekuensi (2960MHz vs 2600MHz)

Penggunaan kuasa lebih rendah (6W berbanding 10W)

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 1000 Plus

523574

Qualcomm Snapdragon 860 +21%

636716

Geekbench 6 Single Core

MediaTek Dimensity 1000 Plus +4%

1040

Qualcomm Snapdragon 860

996

Geekbench 6 Multi Core

MediaTek Dimensity 1000 Plus +22%

3152

Qualcomm Snapdragon 860

2569

FP32 (float)

MediaTek Dimensity 1000 Plus

979

Qualcomm Snapdragon 860 +5%

1036

MediaTek Dimensity 1000 Plus

VS

Qualcomm Snapdragon 860

CPU

4x 2.6 GHz – Cortex-A77
4x 2 GHz – Cortex-A55

Seni bina

1x 2.96 GHz – Cortex-A76 (Kryo 485 Prime)
3x 2.42 GHz – Cortex-A76 (Kryo 485 Gold)
4x 1.8 GHz – Cortex-A55 (Kryo 485 Silver)

2600 MHz

Frekuensi

2960 MHz

8

Teras

8

ARMv8.2-A

Set arahan

ARMv8.2-A

-

Cache L2

1 MB

0

Cache L3

0

7 nm

Proses

7 nm

-

Bilangan transistor

6.7

10 W

TDP

6 W

TSMC

Pembuatan

Samsung

Grafik

Mali-G77 MP9

Nama GPU

Adreno 640

850 MHz

Frekuensi GPU

675 MHz

9

Unit pelaksanaan

2

64

Unit pewarnaan

384

16

Saiz maks

16

0.9792 TFLOPS

FLOPS

1.0368 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR4X

1866 MHz

Frekuensi memori

2133 MHz

4x 16 Bit

Bas

4x 16 Bit

29.87 Gbit/s

Lebar jalur maks

34.13 Gbit/s

Multimedia (ISP)

MediaTek APU 3.0

Pemproses neural (NPU)

Hexagon 690

UFS 2.2

Jenis storan

UFS 3.0, UFS 3.1

2520 x 1080

Resolusi paparan maks

3840 x 2160

1x 80MP, 2x 32MP

Resolusi kamera maks

1x 192MP, 2x 22MP

4K at 30FPS

Rakaman video

4K at 120FPS

4K at 30FPS

Main balik video

8K at 30FPS, 4K at 120FPS

H.264, H.265, AV1, VP9

Codec video

H.264, H.265, VP8, VP9

AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

Helio M70

Modem

X24 LTE, X50 5G

Kesambungan

LTE Cat. 19

Sokongan 4G

LTE Cat. 20

Yes

Sokongan 5G

Yes

Up to 4700 Mbps

Kelajuan muat turun

Up to 5000 Mbps

Up to 2500 Mbps

Kelajuan muat naik

Up to 1240 Mbps

6

Wi-Fi

6

5.1

Bluetooth

5.1

GPS, GLONASS, Beidou, Galileo, QZSS

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Info

Mei 2020

Diumumkan

Apr 2019

Flagship

Kelas

Flagship

MT6889Z/CZA

Nombor model

SM8150-AC

MediaTek Dimensity 1000 Plus

Halaman rasmi

Qualcomm Snapdragon 860

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MediaTek Dimensity 1000 Plus vs Samsung Exynos 7904

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MediaTek Dimensity 1000 Plus vs MediaTek Helio P20

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MediaTek Dimensity 1000 Plus vs MediaTek Dimensity 1000

10

MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 8 Plus Gen 1