MediaTek Helio G37 vs Qualcomm Snapdragon 888 Plus

VS

MediaTek Helio G37

Qualcomm Snapdragon 888 Plus

Kami membandingkan dua versi SoC telefon: 8 teras 2300MHz MediaTek Helio G37 vs. 8 teras 2995MHz Qualcomm Snapdragon 888 Plus. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Helio G37 Kelebihan

Penggunaan kuasa lebih rendah (2.2W berbanding 8W)

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 0.0435 TFLOPS )

Lebar jalur memori yang lebih besar (51.2GB/s vs 13.9GB/s)

Tinggi Frekuensi (2995MHz vs 2300MHz)

Proses pembuatan yang lebih moden (5nm vs 12nm)

Dikeluarkan lewat 1 tahun

Skor

Penanda Aras

AnTuTu 10

MediaTek Helio G37

160199

Qualcomm Snapdragon 888 Plus +422%

836957

Geekbench 6 Single Core

MediaTek Helio G37

206

Qualcomm Snapdragon 888 Plus +497%

1230

Geekbench 6 Multi Core

MediaTek Helio G37

915

Qualcomm Snapdragon 888 Plus +312%

3778

FP32 (float)

MediaTek Helio G37

43

Qualcomm Snapdragon 888 Plus +4209%

1853

MediaTek Helio G37

VS

Qualcomm Snapdragon 888 Plus

CPU

4x 2.3 GHz – Cortex-A53
4x 1.8 GHz – Cortex-A53

Seni bina

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

2300 MHz

Frekuensi

2995 MHz

8

Teras

8

ARMv8.2-A

Set arahan

ARMv8.4-A

-

Cache L2

1 MB

-

Cache L3

0

12 nm

Proses

5 nm

-

Bilangan transistor

10.3

2.2 W

TDP

8 W

TSMC

Pembuatan

Samsung

Grafik

PowerVR GE8320

Nama GPU

Adreno 660

680 MHz

Frekuensi GPU

905 MHz

4

Unit pelaksanaan

2

8

Unit pewarnaan

512

8

Saiz maks

24

0.0435 TFLOPS

FLOPS

1.8534 TFLOPS

1.1

Versi Vulkan

1.1

1.2

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR5

1600 MHz

Frekuensi memori

3200 MHz

2x 16 Bit

Bas

4x 16 Bit

13.9 Gbit/s

Lebar jalur maks

51.2 Gbit/s

Multimedia (ISP)

No

Pemproses neural (NPU)

Hexagon 780

eMMC 5.1

Jenis storan

UFS 3.0, UFS 3.1

2400 x 1080

Resolusi paparan maks

3840 x 2160

1x 50MP, 2x 13MP

Resolusi kamera maks

1x 200MP, 2x 25MP

1K at 30FPS

Rakaman video

8K at 30FPS, 4K at 120FPS

1080p at 30FPS

Main balik video

8K at 30FPS

H.264, H.265

Codec video

H.264, H.265, VP8, VP9

AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

X60

Kesambungan

LTE Cat. 7

Sokongan 4G

LTE Cat. 22

No

Sokongan 5G

Yes

Up to 300 Mbps

Kelajuan muat turun

Up to 7500 Mbps

Up to 150 Mbps

Kelajuan muat naik

Up to 3000 Mbps

5

Wi-Fi

6

5.0

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Jun 2020

Diumumkan

Jun 2021

Low end

Kelas

Flagship

MT6765H

Nombor model

SM8350-AC

MediaTek Helio G37

Halaman rasmi

Qualcomm Snapdragon 888 Plus

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