Qualcomm Snapdragon 778G Plus vs MediaTek Dimensity 8100

VS

Qualcomm Snapdragon 778G Plus MediaTek Dimensity 8100

Kami membandingkan dua versi SoC telefon: 8 teras 2500MHz Qualcomm Snapdragon 778G Plus vs. 8 teras 2850MHz MediaTek Dimensity 8100. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 778G Plus Kelebihan

Penggunaan kuasa lebih rendah (5W berbanding 6W)

MediaTek Dimensity 8100 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.309 TFLOPS vs 0.8448 TFLOPS )

Lebar jalur memori yang lebih besar (51.2GB/s vs 25.6GB/s)

Tinggi Frekuensi (2850MHz vs 2500MHz)

Proses pembuatan yang lebih moden (5nm vs 6nm)

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 778G Plus

616678

MediaTek Dimensity 8100 +39%

860129

Geekbench 6 Single Core

Qualcomm Snapdragon 778G Plus

1069

MediaTek Dimensity 8100 +7%

1145

Geekbench 6 Multi Core

Qualcomm Snapdragon 778G Plus

3008

MediaTek Dimensity 8100 +20%

3633

FP32 (float)

Qualcomm Snapdragon 778G Plus

844

MediaTek Dimensity 8100 +55%

1309

Qualcomm Snapdragon 778G Plus

VS

MediaTek Dimensity 8100

CPU

1x 2.5 GHz – Kryo 670 Prime (Cortex-A78)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)

Seni bina

4x 2.85 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

2500 MHz

Frekuensi

2850 MHz

8

Teras

8

2 MB

Cache L2

-

Cache L3

0

6 nm

Proses

5 nm

5 W

TDP

6 W

TSMC

Pembuatan

TSMC

Grafik

Adreno 642

Nama GPU

Mali-G610 MP6

550 MHz

Frekuensi GPU

860 MHz

2

Unit pelaksanaan

6

384

Unit pewarnaan

-

16

Saiz maks

16

0.8448 TFLOPS

FLOPS

1.309 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR5

3200 MHz

Frekuensi memori

3200 MHz

2x 16 Bit

Bas

4x 16 Bit

25.6 Gbit/s

Lebar jalur maks

51.2 Gbit/s

AI

Hexagon 770

Pemproses neural (NPU)

Yes

Multimedia (ISP)

Hexagon 770

Pemproses neural (NPU)

Yes

UFS 2.2, UFS 3.0, UFS 3.1

Jenis storan

UFS 3.1

2520 x 1080

Resolusi paparan maks

2960 x 1440

1x 192MP

Resolusi kamera maks

1x 200MP

4K at 30FPS

Rakaman video

4K at 60FPS

4K at 30FPS

Main balik video

4K at 60FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

X53

Modem

MediaTek UltraSave 2.0

Kesambungan

LTE Cat. 24

Sokongan 4G

LTE Cat. 21

Yes

Sokongan 5G

Yes

Up to 3700 Mbps

Kelajuan muat turun

Up to 4700 Mbps

Up to 1600 Mbps

Kelajuan muat naik

Up to 2500 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.3

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Okt 2021

Diumumkan

Mac 2022

Mid range

Kelas

Flagship

SM7325-AE

Nombor model

MT6895Z/TCZA

Qualcomm Snapdragon 778G Plus

Halaman rasmi

MediaTek Dimensity 8100

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