Qualcomm Snapdragon 855 Plus vs MediaTek Dimensity 7050

VS

Qualcomm Snapdragon 855 Plus MediaTek Dimensity 7050

Kami membandingkan dua versi SoC telefon: 8 teras 2960MHz Qualcomm Snapdragon 855 Plus vs. 8 teras 2600MHz MediaTek Dimensity 7050. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 855 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.0368 TFLOPS vs 0.686 TFLOPS )

Tinggi Frekuensi (2960MHz vs 2600MHz)

MediaTek Dimensity 7050 Kelebihan

Proses pembuatan yang lebih moden (6nm vs 7nm)

Penggunaan kuasa lebih rendah (4W berbanding 6W)

Dikeluarkan lewat 3 tahun dan 10 bulan

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 855 Plus +3%

552687

MediaTek Dimensity 7050

535270

Geekbench 6 Single Core

Qualcomm Snapdragon 855 Plus +8%

1040

MediaTek Dimensity 7050

962

Geekbench 6 Multi Core

Qualcomm Snapdragon 855 Plus +21%

2865

MediaTek Dimensity 7050

2364

FP32 (float)

Qualcomm Snapdragon 855 Plus +51%

1036

MediaTek Dimensity 7050

686

Qualcomm Snapdragon 855 Plus

VS

MediaTek Dimensity 7050

CPU

1x 2.96 GHz – Cortex-A76 (Kryo 485 Gold)
3x 2.42 GHz – Cortex-A76 (Kryo 485 Gold)
4x 1.8 GHz – Cortex-A55 (Kryo 485 Silver)

Seni bina

2x 2.6 GHz – Cortex-A78
6x 2 GHz – Cortex-A55

2960 MHz

Frekuensi

2600 MHz

8

Teras

8

1 MB

Cache L2

-

0

Cache L3

-

7 nm

Proses

6 nm

6.7

Bilangan transistor

-

6 W

TDP

4 W

TSMC

Pembuatan

TSMC

Grafik

Adreno 640

Nama GPU

Mali-G68 MP4

675 MHz

Frekuensi GPU

800 MHz

2

Unit pelaksanaan

4

384

Unit pewarnaan

-

16

Saiz maks

16

1.0368 TFLOPS

FLOPS

0.686 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

-

Memori

LPDDR4X

Jenis memori

LPDDR5

2133 MHz

Frekuensi memori

3200 MHz

4x 16 Bit

Bas

4x 16 Bit

34.13 Gbit/s

Lebar jalur maks

-

AI

Hexagon 690

Pemproses neural (NPU)

MediaTek APU 550

Multimedia (ISP)

Hexagon 690

Pemproses neural (NPU)

MediaTek APU 550

UFS 3.0

Jenis storan

UFS 2.1, UFS 2.2, UFS 3.0, UFS 3.1

3840 x 2160

Resolusi paparan maks

2520 x 1080

1x 192MP, 2x 22MP

Resolusi kamera maks

1x 200MP

4K at 120FPS

Rakaman video

4K at 30FPS

8K at 30FPS, 4K at 120FPS

Main balik video

4K at 30FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

X24 LTE, X50 5G

Modem

-

Kesambungan

LTE Cat. 20

Sokongan 4G

LTE Cat. 18

Yes

Sokongan 5G

Yes

Up to 5000 Mbps

Kelajuan muat turun

Up to 2770 Mbps

Up to 1240 Mbps

Kelajuan muat naik

Up to 1250 Mbps

6

Wi-Fi

6

5.0

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Jul 2019

Diumumkan

Mei 2023

Flagship

Kelas

Mid range

SM8150-AC

Nombor model

MT6877 MT6877V/TTZA

Qualcomm Snapdragon 855 Plus

Halaman rasmi

MediaTek Dimensity 7050

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8

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9

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10

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