HiSilicon Kirin 970 vs Qualcomm Snapdragon 855

VS

HiSilicon Kirin 970 Qualcomm Snapdragon 855

We compared two versions of phone SoCs: 8 cores 2360MHz HiSilicon Kirin 970 vs. 8 cores 2840MHz Qualcomm Snapdragon 855 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 855 Advantages

Better graphics card performance FLOPS (0.8985 TFLOPS vs 0.3318 TFLOPS )

Larger memory bandwidth (34.13GB/s vs 29.8GB/s)

Higher Frequency (2840MHz vs 2360MHz)

More modern manufacturing process (7nm vs 10nm)

Lower TDP (6W vs 9W)

Released 1 years and 3 months late

Score

Benchmark

AnTuTu 10

HiSilicon Kirin 970

355946

Qualcomm Snapdragon 855 +66%

592031

Geekbench 6 Single Core

HiSilicon Kirin 970

386

Qualcomm Snapdragon 855 +143%

939

Geekbench 6 Multi Core

HiSilicon Kirin 970

1377

Qualcomm Snapdragon 855 +107%

2855

FP32 (float)

HiSilicon Kirin 970

331

Qualcomm Snapdragon 855 +171%

898

HiSilicon Kirin 970

VS

Qualcomm Snapdragon 855

CPU

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

Architecture

1x 2.84 GHz – Cortex-A76 (Kryo 485 Gold)
3x 2.42 GHz – Cortex-A76 (Kryo 485 Gold)
4x 1.8 GHz – Cortex-A55 (Kryo 485 Silver)

2360 MHz

Frequency

2840 MHz

8

Cores

8

2 MB

L2 cache

1 MB

0

L3 cache

0

10 nm

Process

7 nm

5.5

Transistor count

6.7

9 W

TDP

6 W

TSMC

Manufacturing

TSMC

Graphics

Mali-G72 MP12

GPU name

Adreno 640

768 MHz

GPU frequency

585 MHz

12

Execution units

2

18

Shading units

384

8

Max size

16

0.3318 TFLOPS

FLOPS

0.8985 TFLOPS

1.3

Vulkan version

1.1

2.0

OpenCL version

2.0

12

DirectX version

12.1

Memory

LPDDR4X

Memory type

LPDDR4X

1866 MHz

Memory frequency

2133 MHz

4x 16 Bit

Bus

4x 16 Bit

29.8 Gbit/s

Max bandwidth

34.13 Gbit/s

AI

Yes

NPU

Hexagon 690

Multimedia (ISP)

Yes

Neural processor (NPU)

Hexagon 690

UFS 2.1

Storage type

UFS 3.0

3120 x 1440

Max display resolution

3840 x 2160

1x 48MP, 2x 20MP

Max camera resolution

1x 192MP, 2x 22MP

4K at 30FPS

Video capture

4K at 120FPS

4K at 30FPS

Video playback

8K at 30FPS, 4K at 120FPS

H.264, H.265, VP8, VP9, VC-1

Video codecs

H.264, H.265, VP8, VP9

32 bit@384 kHz, HD-audio

Audio codecs

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

X24 LTE, X50 5G

Connectivity

LTE Cat. 18

4G support

LTE Cat. 20

No

5G support

Yes

Up to 1200 Mbps

Download speed

Up to 5000 Mbps

Up to 150 Mbps

Upload speed

Up to 1240 Mbps

5

Wi-Fi

6

4.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Info

Sep 2017

Announced

Dec 2018

Flagship

Class

Flagship

Hi3670

Model number

SM8150

HiSilicon Kirin 970

Official page

Qualcomm Snapdragon 855

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