Qualcomm Snapdragon 778G Plus vs HiSilicon Kirin 990 4G

VS

Qualcomm Snapdragon 778G Plus HiSilicon Kirin 990 4G

We compared two versions of phone SoCs: 8 cores 2500MHz Qualcomm Snapdragon 778G Plus vs. 8 cores 2860MHz HiSilicon Kirin 990 4G . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 778G Plus Advantages

Better graphics card performance FLOPS (0.8448 TFLOPS vs 0.6912 TFLOPS )

More modern manufacturing process (6nm vs 7nm)

Lower TDP (5W vs 6W)

Released 2 years late

HiSilicon Kirin 990 4G Advantages

Larger memory bandwidth (34.1GB/s vs 25.6GB/s)

Higher Frequency (2860MHz vs 2500MHz)

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 778G Plus

616678

HiSilicon Kirin 990 4G +12%

695853

Geekbench 6 Single Core

Qualcomm Snapdragon 778G Plus +7%

1069

HiSilicon Kirin 990 4G

990

Geekbench 6 Multi Core

Qualcomm Snapdragon 778G Plus

3008

HiSilicon Kirin 990 4G +5%

3179

FP32 (float)

Qualcomm Snapdragon 778G Plus +22%

844

HiSilicon Kirin 990 4G

691

Qualcomm Snapdragon 778G Plus

VS

HiSilicon Kirin 990 4G

CPU

1x 2.5 GHz – Kryo 670 Prime (Cortex-A78)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)

Architecture

2x 2.86 GHz – Cortex-A76
2x 2.09 GHz – Cortex-A76
4x 1.86 GHz – Cortex-A55

2500 MHz

Frequency

2860 MHz

8

Cores

8

2 MB

L2 cache

2 MB

6 nm

Process

7 nm

-

Transistor count

8

5 W

TDP

6 W

TSMC

Manufacturing

TSMC

Graphics

Adreno 642

GPU name

Mali-G76 MP16

550 MHz

GPU frequency

600 MHz

2

Execution units

16

384

Shading units

36

16

Max size

12

0.8448 TFLOPS

FLOPS

0.6912 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR4X

3200 MHz

Memory frequency

2133 MHz

2x 16 Bit

Bus

4x 16 Bit

25.6 Gbit/s

Max bandwidth

34.1 Gbit/s

AI

Hexagon 770

NPU

Da Vinci

Multimedia (ISP)

Hexagon 770

Neural processor (NPU)

Da Vinci

UFS 2.2, UFS 3.0, UFS 3.1

Storage type

UFS 2.1, UFS 3.0

2520 x 1080

Max display resolution

3360 x 1440

1x 192MP

Max camera resolution

-

4K at 30FPS

Video capture

4K at 60FPS

4K at 30FPS

Video playback

4K at 60FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, VC-1

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

AIFF, CAF, MP3, MP4, WAV

X53

Modem

Balong 765

Connectivity

LTE Cat. 24

4G support

LTE Cat. 19

Yes

5G support

No

Up to 3700 Mbps

Download speed

Up to 1400 Mbps

Up to 1600 Mbps

Upload speed

Up to 200 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo

Info

Oct 2021

Announced

Oct 2019

Mid range

Class

Flagship

SM7325-AE

Model number

-

Qualcomm Snapdragon 778G Plus

Official page

HiSilicon Kirin 990 4G

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