Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 990 5G

VS

Qualcomm Snapdragon 888 Plus

HiSilicon Kirin 990 5G

We compared two versions of phone SoCs: 8 cores 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 cores 2860MHz HiSilicon Kirin 990 5G . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 888 Plus Advantages

Better graphics card performance FLOPS (1.8534 TFLOPS vs 0.6912 TFLOPS )

Larger memory bandwidth (51.2GB/s vs 34.1GB/s)

Higher Frequency (2995MHz vs 2860MHz)

More modern manufacturing process (5nm vs 7nm)

Released 1 years and 8 months late

HiSilicon Kirin 990 5G Advantages

Lower TDP (6W vs 8W)

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 888 Plus +25%

836957

HiSilicon Kirin 990 5G

665287

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +26%

1230

HiSilicon Kirin 990 5G

969

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +18%

3778

HiSilicon Kirin 990 5G

3176

FP32 (float)

Qualcomm Snapdragon 888 Plus +168%

1853

HiSilicon Kirin 990 5G

691

Qualcomm Snapdragon 888 Plus

VS

HiSilicon Kirin 990 5G

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Architecture

2x 2.86 GHz – Cortex-A76
2x 2.36 GHz – Cortex-A76
4x 1.95 GHz – Cortex-A55

2995 MHz

Frequency

2860 MHz

8

Cores

8

ARMv8.4-A

Instruction set

ARMv8.2-A

1 MB

L2 cache

2 MB

0

L3 cache

-

5 nm

Process

7 nm

10.3

Transistor count

8

8 W

TDP

6 W

Samsung

Manufacturing

TSMC

Graphics

Adreno 660

GPU name

Mali-G76 MP16

905 MHz

GPU frequency

600 MHz

2

Execution units

16

512

Shading units

36

24

Max size

12

1.8534 TFLOPS

FLOPS

0.6912 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR4X

3200 MHz

Memory frequency

2133 MHz

4x 16 Bit

Bus

4x 16 Bit

51.2 Gbit/s

Max bandwidth

34.1 Gbit/s

Multimedia (ISP)

Hexagon 780

Neural processor (NPU)

Da Vinci

UFS 3.0, UFS 3.1

Storage type

UFS 2.1, UFS 3.0

3840 x 2160

Max display resolution

3360 x 1440

1x 200MP, 2x 25MP

Max camera resolution

-

8K at 30FPS, 4K at 120FPS

Video capture

4K at 60FPS

8K at 30FPS

Video playback

4K at 60FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, VC-1

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

AIFF, CAF, MP3, MP4, WAV

X60

Modem

Balong 5000

Connectivity

LTE Cat. 22

4G support

LTE Cat. 24

Yes

5G support

Yes

Up to 7500 Mbps

Download speed

Up to 4600 Mbps

Up to 3000 Mbps

Upload speed

Up to 1250 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigation

GPS, GLONASS, Beidou

Info

Jun 2021

Announced

Oct 2019

Flagship

Class

Flagship

SM8350-AC

Model number

-

Qualcomm Snapdragon 888 Plus

Official page

HiSilicon Kirin 990 5G

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