Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 1200

VS

Qualcomm Snapdragon 888 Plus

MediaTek Dimensity 1200

We compared two versions of phone SoCs: 8 cores 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 cores 3000MHz MediaTek Dimensity 1200 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 888 Plus Advantages

Better graphics card performance FLOPS (1.8534 TFLOPS vs 0.9792 TFLOPS )

Larger memory bandwidth (51.2GB/s vs 34.1GB/s)

More modern manufacturing process (5nm vs 6nm)

Lower TDP (8W vs 10W)

MediaTek Dimensity 1200 Advantages

Higher Frequency (3000MHz vs 2995MHz)

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 888 Plus +15%

836957

MediaTek Dimensity 1200

722511

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +10%

1230

MediaTek Dimensity 1200

1118

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +18%

3778

MediaTek Dimensity 1200

3198

FP32 (float)

Qualcomm Snapdragon 888 Plus +89%

1853

MediaTek Dimensity 1200

979

Qualcomm Snapdragon 888 Plus

VS

MediaTek Dimensity 1200

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Architecture

1x 3 GHz – Cortex-A78
3x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

2995 MHz

Frequency

3000 MHz

8

Cores

8

ARMv8.4-A

Instruction set

ARMv8.2-A

1 MB

L2 cache

320 KB

0

L3 cache

0

5 nm

Process

6 nm

10.3

Transistor count

-

8 W

TDP

10 W

Samsung

Manufacturing

TSMC

Graphics

Adreno 660

GPU name

Mali-G77 MP9

905 MHz

GPU frequency

850 MHz

2

Execution units

9

512

Shading units

64

24

Max size

16

1.8534 TFLOPS

FLOPS

0.9792 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR4X

3200 MHz

Memory frequency

2133 MHz

4x 16 Bit

Bus

4x 16 Bit

51.2 Gbit/s

Max bandwidth

34.1 Gbit/s

Multimedia (ISP)

Hexagon 780

Neural processor (NPU)

MediaTek APU 3.0

UFS 3.0, UFS 3.1

Storage type

UFS 3.1

3840 x 2160

Max display resolution

2520 x 1080

1x 200MP, 2x 25MP

Max camera resolution

1x 200MP, 2x 32MP

8K at 30FPS, 4K at 120FPS

Video capture

4K at 60FPS

8K at 30FPS

Video playback

4K at 60FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

AIFF, CAF, MP3, MP4, WAV

X60

Modem

Helio M70

Connectivity

LTE Cat. 22

4G support

LTE Cat. 19

Yes

5G support

Yes

Up to 7500 Mbps

Download speed

Up to 4700 Mbps

Up to 3000 Mbps

Upload speed

Up to 2500 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Jun 2021

Announced

Jan 2021

Flagship

Class

Flagship

SM8350-AC

Model number

MT6893

Qualcomm Snapdragon 888 Plus

Official page

MediaTek Dimensity 1200

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