In accordance with TSMC's arrangement, the 2nm process node will be the first to use Gate-All-Around Field-Effect Transistors (GAAFETs). The manufacturing process still relies on extreme ultraviolet (EUV) lithography and is planned to enter high-volume production in 2025. Customers can expect to receive the first batch of chips made with the N2 process in 2026.

According to Trendforce, TSMC is aggressively installing EUV lithography, which is crucial for advanced processes, to prepare for the mass production of the 2nm process. This year and next year, they will take delivery of more than 60 EUV lithography machines, with capital investments exceeding NT$400 billion (US$12.3 billion/CNY 89.4 billion).

As ASML continues to expand its production capacity, deliveries of EUV lithography machines are expected to grow by more than 30% in 2025, benefiting TSMC. Last year, ASML planned to increase production to meet customer demand, with significant EUV lithography deliveries expected—53 units this year, rising to over 72 units next year. ASML's target capacity for 2025 includes 90 EUV lithography machines, 600 DUV lithography machines, and 20 High-NA EUV lithography machines.

The supply of EUV lithography has been tight, with lead times ranging from 16 to 20 months, and most of the 2024 orders will not be delivered until 2025. TSMC is rumored to have ordered 30 EUV lithography machines for 2024 and 35 for 2025. However, these numbers might change slightly as TSMC could adjust its capital expenditure program. Additionally, TSMC is expected to receive the latest High-NA EUV lithography machine sometime this year.