Qualcomm Snapdragon 888 Plus vs MediaTek Helio G37

VS

Qualcomm Snapdragon 888 Plus

MediaTek Helio G37

Kami membandingkan dua versi SoC telefon: 8 teras 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 teras 2300MHz MediaTek Helio G37. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 0.0435 TFLOPS )

Lebar jalur memori yang lebih besar (51.2GB/s vs 13.9GB/s)

Tinggi Frekuensi (2995MHz vs 2300MHz)

Proses pembuatan yang lebih moden (5nm vs 12nm)

Dikeluarkan lewat 1 tahun

MediaTek Helio G37 Kelebihan

Penggunaan kuasa lebih rendah (2.2W berbanding 8W)

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 888 Plus +422%

836957

MediaTek Helio G37

160199

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +497%

1230

MediaTek Helio G37

206

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +312%

3778

MediaTek Helio G37

915

FP32 (float)

Qualcomm Snapdragon 888 Plus +4209%

1853

MediaTek Helio G37

43

Qualcomm Snapdragon 888 Plus

VS

MediaTek Helio G37

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Seni bina

4x 2.3 GHz – Cortex-A53
4x 1.8 GHz – Cortex-A53

2995 MHz

Frekuensi

2300 MHz

8

Teras

8

ARMv8.4-A

Set arahan

ARMv8.2-A

1 MB

Cache L2

-

0

Cache L3

-

5 nm

Proses

12 nm

10.3

Bilangan transistor

-

8 W

TDP

2.2 W

Samsung

Pembuatan

TSMC

Grafik

Adreno 660

Nama GPU

PowerVR GE8320

905 MHz

Frekuensi GPU

680 MHz

2

Unit pelaksanaan

4

512

Unit pewarnaan

8

24

Saiz maks

8

1.8534 TFLOPS

FLOPS

0.0435 TFLOPS

1.1

Versi Vulkan

1.1

2.0

Versi OpenCL

1.2

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR4X

3200 MHz

Frekuensi memori

1600 MHz

4x 16 Bit

Bas

2x 16 Bit

51.2 Gbit/s

Lebar jalur maks

13.9 Gbit/s

Multimedia (ISP)

Hexagon 780

Pemproses neural (NPU)

No

UFS 3.0, UFS 3.1

Jenis storan

eMMC 5.1

3840 x 2160

Resolusi paparan maks

2400 x 1080

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 50MP, 2x 13MP

8K at 30FPS, 4K at 120FPS

Rakaman video

1K at 30FPS

8K at 30FPS

Main balik video

1080p at 30FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AIFF, CAF, MP3, MP4, WAV

X60

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 7

Yes

Sokongan 5G

No

Up to 7500 Mbps

Kelajuan muat turun

Up to 300 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 150 Mbps

6

Wi-Fi

5

5.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS

Info

Jun 2021

Diumumkan

Jun 2020

Flagship

Kelas

Low end

SM8350-AC

Nombor model

MT6765H

Qualcomm Snapdragon 888 Plus

Halaman rasmi

MediaTek Helio G37

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Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 935

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Qualcomm Snapdragon 888 Plus vs Apple A11 Bionic

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Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 7050

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