HiSilicon Kirin 9000 vs Qualcomm Snapdragon 888 Plus

VS

HiSilicon Kirin 9000 Qualcomm Snapdragon 888 Plus

Kami membandingkan dua versi SoC telefon: 8 teras 3130MHz HiSilicon Kirin 9000 vs. 8 teras 2995MHz Qualcomm Snapdragon 888 Plus. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

HiSilicon Kirin 9000 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (2.3316 TFLOPS vs 1.8534 TFLOPS )

Tinggi Frekuensi (3130MHz vs 2995MHz)

Penggunaan kuasa lebih rendah (6W berbanding 8W)

Qualcomm Snapdragon 888 Plus Kelebihan

Lebar jalur memori yang lebih besar (51.2GB/s vs 44GB/s)

Dikeluarkan lewat 8 bulan

Skor

Penanda Aras

AnTuTu 10

HiSilicon Kirin 9000 +8%

907784

Qualcomm Snapdragon 888 Plus

836957

Geekbench 6 Single Core

HiSilicon Kirin 9000 +2%

1266

Qualcomm Snapdragon 888 Plus

1230

Geekbench 6 Multi Core

HiSilicon Kirin 9000

3529

Qualcomm Snapdragon 888 Plus +7%

3778

FP32 (float)

HiSilicon Kirin 9000 +25%

2331

Qualcomm Snapdragon 888 Plus

1853

HiSilicon Kirin 9000

VS

Qualcomm Snapdragon 888 Plus

CPU

1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55

Seni bina

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

3130 MHz

Frekuensi

2995 MHz

8

Teras

8

-

Cache L2

1 MB

-

Cache L3

0

5 nm

Proses

5 nm

15.3

Bilangan transistor

10.3

6 W

TDP

8 W

TSMC

Pembuatan

Samsung

Grafik

Mali-G78 MP24

Nama GPU

Adreno 660

759 MHz

Frekuensi GPU

905 MHz

24

Unit pelaksanaan

2

64

Unit pewarnaan

512

16

Saiz maks

24

2.3316 TFLOPS

FLOPS

1.8534 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR5

Jenis memori

LPDDR5

2750 MHz

Frekuensi memori

3200 MHz

4x 16 Bit

Bas

4x 16 Bit

44 Gbit/s

Lebar jalur maks

51.2 Gbit/s

AI

AI accelerator

Pemproses neural (NPU)

Hexagon 780

Multimedia (ISP)

AI accelerator

Pemproses neural (NPU)

Hexagon 780

UFS 3.1

Jenis storan

UFS 3.0, UFS 3.1

3840 x 2160

Resolusi paparan maks

3840 x 2160

-

Resolusi kamera maks

1x 200MP, 2x 25MP

4K at 60FPS

Rakaman video

8K at 30FPS, 4K at 120FPS

4K at 60FPS

Main balik video

8K at 30FPS

H.264, H.265, VP9

Codec video

H.264, H.265, VP8, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

Balong 5000

Modem

X60

Kesambungan

LTE Cat. 24

Sokongan 4G

LTE Cat. 22

Yes

Sokongan 5G

Yes

Up to 4600 Mbps

Kelajuan muat turun

Up to 7500 Mbps

Up to 2500 Mbps

Kelajuan muat naik

Up to 3000 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Okt 2020

Diumumkan

Jun 2021

Flagship

Kelas

Flagship

-

Nombor model

SM8350-AC

HiSilicon Kirin 9000

Halaman rasmi

Qualcomm Snapdragon 888 Plus

Perbandingan SoC Berkaitan

1

HiSilicon Kirin 9000 vs Qualcomm Snapdragon 8 Gen 2

2

HiSilicon Kirin 9000 vs Qualcomm Snapdragon 8 Gen 1

3

Qualcomm Snapdragon 7 Gen 1 vs HiSilicon Kirin 9000

4

HiSilicon Kirin 9000 vs MediaTek Dimensity 9200 Plus

5

HiSilicon Kirin 9010 vs HiSilicon Kirin 9000

6

HiSilicon Kirin 9000 vs Unisoc SC9863A

7

HiSilicon Kirin 9000 vs Qualcomm Snapdragon 865

8

Qualcomm Snapdragon 7 Plus Gen 3 vs Qualcomm Snapdragon 888 Plus

9

HiSilicon Kirin 9000 vs Qualcomm Snapdragon 865

10

HiSilicon Kirin 9000 vs MediaTek Dimensity 9400