MediaTek Dimensity 6100 Plus vs Qualcomm Snapdragon 870

VS

MediaTek Dimensity 6100 Plus

Qualcomm Snapdragon 870

Kami membandingkan dua versi SoC telefon: 8 teras 2200MHz MediaTek Dimensity 6100 Plus vs. 8 teras 3200MHz Qualcomm Snapdragon 870. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 6100 Plus Kelebihan

Proses pembuatan yang lebih moden (6nm vs 7nm)

Dikeluarkan lewat 2 tahun dan 6 bulan

Qualcomm Snapdragon 870 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.3721 TFLOPS vs 0.2432 TFLOPS )

Lebar jalur memori yang lebih besar (44GB/s vs 17.07GB/s)

Tinggi Frekuensi (3200MHz vs 2200MHz)

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 6100 Plus

413197

Qualcomm Snapdragon 870 +96%

810488

Geekbench 6 Single Core

MediaTek Dimensity 6100 Plus

771

Qualcomm Snapdragon 870 +49%

1151

Geekbench 6 Multi Core

MediaTek Dimensity 6100 Plus

1965

Qualcomm Snapdragon 870 +69%

3336

FP32 (float)

MediaTek Dimensity 6100 Plus

243

Qualcomm Snapdragon 870 +464%

1372

MediaTek Dimensity 6100 Plus

VS

Qualcomm Snapdragon 870

CPU

2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55

Seni bina

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

2200 MHz

Frekuensi

3200 MHz

8

Teras

8

ARMv8.2-A

Set arahan

ARMv8.2-A

1 MB

Cache L2

1 MB

0

Cache L3

0

6 nm

Proses

7 nm

-

Bilangan transistor

10.3

-

TDP

6 W

TSMC

Pembuatan

TSMC

Grafik

Mali-G57 MP2

Nama GPU

Adreno 650

950 MHz

Frekuensi GPU

670 MHz

2

Unit pelaksanaan

2

64

Unit pewarnaan

512

12

Saiz maks

16

0.2432 TFLOPS

FLOPS

1.3721 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

-

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR5

2133 MHz

Frekuensi memori

2750 MHz

2x 16 Bit

Bas

4x 16 Bit

17.07 Gbit/s

Lebar jalur maks

44 Gbit/s

Multimedia (ISP)

Yes

Pemproses neural (NPU)

Hexagon 698

UFS 2.2

Jenis storan

UFS 3.0, UFS 3.1

2520 x 1080

Resolusi paparan maks

3840 x 2160

1x 108MP, 2x 16MP

Resolusi kamera maks

1x 200MP, 2x 25MP

2K at 30FPS

Rakaman video

8K at 30FPS, 4K at 60FPS

2K at 30FPS

Main balik video

8K at 30FPS, 4K at 60FPS

H.264, H.265, VP9

Codec video

H.264, H.265, VP8, VP9

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

X55

Kesambungan

-

Sokongan 4G

LTE Cat. 22

Yes

Sokongan 5G

Yes

Up to 3300 Mbps

Kelajuan muat turun

Up to 7500 Mbps

-

Kelajuan muat naik

Up to 3000 Mbps

5

Wi-Fi

6

5.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Jul 2023

Diumumkan

Jan 2021

Mid range

Kelas

Flagship

-

Nombor model

SM8250-AC

MediaTek Dimensity 6100 Plus

Halaman rasmi

Qualcomm Snapdragon 870

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