CPU
GPU
SoC
Router
Categories
Rankings
CPU Rankings
GPU Rankings
SoC Rankings
Router Ranking
English
English
Close menu
Home
CPU
GPU
SoC
Router
Categories
CPU Rankings
GPU Rankings
SoC Rankings
Router Ranking
中文
English
Español
Deutsch
Français
Italiano
Português
日本語
한국어
العربية
ภาษาไทย
繁體中文
Tiếng Việt
Bahasa Melayu
中文
English
Español
Deutsch
Français
Italiano
Português
日本語
한국어
العربية
ภาษาไทย
繁體中文
Tiếng Việt
Bahasa Melayu
Home
Mobile and Tablet SoC Comparison
HiSilicon Kirin 659 vs Qualcomm Snapdragon 888 Plus
HiSilicon Kirin 659 vs Qualcomm Snapdragon 888 Plus
VS
HiSilicon Kirin 659
Qualcomm Snapdragon 888 Plus
We compared two versions of phone SoCs: 8 cores 2360MHz HiSilicon Kirin 659 vs. 8 cores 2995MHz Qualcomm Snapdragon 888 Plus . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.
Main Differences
Qualcomm Snapdragon 888 Plus Advantages
Better graphics card performance FLOPS (1.8534 TFLOPS vs 0.0576 TFLOPS )
Higher Frequency (2995MHz vs 2360MHz)
More modern manufacturing process (5nm vs 16nm)
Released 4 years and 5 months late
Score
Benchmark
AnTuTu 10
HiSilicon Kirin 659
103952
Qualcomm Snapdragon 888 Plus
+705%
836957
Geekbench 6 Single Core
HiSilicon Kirin 659
215
Qualcomm Snapdragon 888 Plus
+472%
1230
Geekbench 6 Multi Core
HiSilicon Kirin 659
810
Qualcomm Snapdragon 888 Plus
+366%
3778
FP32 (float)
HiSilicon Kirin 659
57
Qualcomm Snapdragon 888 Plus
+3150%
1853
HiSilicon Kirin 659
VS
Qualcomm Snapdragon 888 Plus
CPU
4x 2.36 GHz – Cortex-A53
4x 1.7 GHz – Cortex-A53
Architecture
1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)
2360 MHz
Frequency
2995 MHz
8
Cores
8
ARMv8-A
Instruction set
ARMv8.4-A
-
L2 cache
1 MB
-
L3 cache
0
16 nm
Process
5 nm
4
Transistor count
10.3
-
TDP
8 W
-
Manufacturing
Samsung
Graphics
Mali-T830 MP2
GPU name
Adreno 660
900 MHz
GPU frequency
905 MHz
2
Execution units
2
16
Shading units
512
4
Max size
24
0.0576 TFLOPS
FLOPS
1.8534 TFLOPS
1.0
Vulkan version
1.1
1.2
OpenCL version
2.0
11
DirectX version
12.1
Memory
LPDDR3
Memory type
LPDDR5
933 MHz
Memory frequency
3200 MHz
2x 32 Bit
Bus
4x 16 Bit
-
Max bandwidth
51.2 Gbit/s
Multimedia (ISP)
No
Neural processor (NPU)
Hexagon 780
eMMC 5.1
Storage type
UFS 3.0, UFS 3.1
1920 x 1200
Max display resolution
3840 x 2160
1x 16MP, 2x 8MP
Max camera resolution
1x 200MP, 2x 25MP
1K at 60FPS
Video capture
8K at 30FPS, 4K at 120FPS
1080p at 60FPS
Video playback
8K at 30FPS
H.264, H.265
Video codecs
H.264, H.265, VP8, VP9
AIFF, CAF, MP3, MP4, WAV
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
-
Modem
X60
Connectivity
LTE Cat. 7
4G support
LTE Cat. 22
No
5G support
Yes
Up to 300 Mbps
Download speed
Up to 7500 Mbps
Up to 50 Mbps
Upload speed
Up to 3000 Mbps
4
Wi-Fi
6
4.2
Bluetooth
5.2
GPS, GLONASS, Beidou
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Info
Jan 2017
Announced
Jun 2021
Mid range
Class
Flagship
Hi6250
Model number
SM8350-AC
-
Official page
Qualcomm Snapdragon 888 Plus
Related SoC Comparison
1
HiSilicon Kirin 659 vs HiSilicon Kirin 950
2
HiSilicon Kirin 659 vs MediaTek Dimensity 720
3
HiSilicon Kirin 659 vs Samsung Exynos 1580
4
HiSilicon Kirin 659 vs Apple A18
5
HiSilicon Kirin 659 vs Samsung Exynos 2400
6
HiSilicon Kirin 659 vs MediaTek Dimensity 700
7
HiSilicon Kirin 659 vs MediaTek Helio X30
8
HiSilicon Kirin 659 vs Qualcomm Snapdragon 765G
9
HiSilicon Kirin 659 vs MediaTek Dimensity 1080
10
HiSilicon Kirin 659 vs Qualcomm Snapdragon 685
© 2024 - TopCPU.net
Contact Us
Privacy Policy