Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 710

VS

Qualcomm Snapdragon 888 Plus HiSilicon Kirin 710

Kami membandingkan dua versi SoC telefon: 8 teras 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 teras 2200MHz HiSilicon Kirin 710. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 0.128 TFLOPS )

Tinggi Frekuensi (2995MHz vs 2200MHz)

Proses pembuatan yang lebih moden (5nm vs 12nm)

Dikeluarkan lewat 2 tahun dan 11 bulan

HiSilicon Kirin 710 Kelebihan

Penggunaan kuasa lebih rendah (5W berbanding 8W)

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 888 Plus +314%

836957

HiSilicon Kirin 710

202054

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +245%

1230

HiSilicon Kirin 710

356

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +215%

3778

HiSilicon Kirin 710

1197

FP32 (float)

Qualcomm Snapdragon 888 Plus +1347%

1853

HiSilicon Kirin 710

128

Qualcomm Snapdragon 888 Plus

VS

HiSilicon Kirin 710

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Seni bina

4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53

2995 MHz

Frekuensi

2200 MHz

8

Teras

8

1 MB

Cache L2

512 KB

0

Cache L3

0

5 nm

Proses

12 nm

10.3

Bilangan transistor

5.5

8 W

TDP

5 W

Samsung

Pembuatan

TSMC

Grafik

Adreno 660

Nama GPU

Mali-G51 MP4

905 MHz

Frekuensi GPU

1000 MHz

2

Unit pelaksanaan

4

512

Unit pewarnaan

16

24

Saiz maks

6

1.8534 TFLOPS

FLOPS

0.128 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR4X

3200 MHz

Frekuensi memori

1866 MHz

4x 16 Bit

Bas

2x 32 Bit

51.2 Gbit/s

Lebar jalur maks

-

AI

Hexagon 780

Pemproses neural (NPU)

No

Multimedia (ISP)

Hexagon 780

Pemproses neural (NPU)

No

UFS 3.0, UFS 3.1

Jenis storan

eMMC 5.1, UFS 2.1

3840 x 2160

Resolusi paparan maks

2340 x 1080

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 40MP, 2x 24MP

8K at 30FPS, 4K at 120FPS

Rakaman video

1K at 30FPS

8K at 30FPS

Main balik video

1080p at 60FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, VP8, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AIFF, CAF, MP3, MP4, WAV

X60

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 12

Yes

Sokongan 5G

No

Up to 7500 Mbps

Kelajuan muat turun

Up to 600 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 150 Mbps

6

Wi-Fi

4

5.2

Bluetooth

4.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo

Info

Jun 2021

Diumumkan

Jul 2018

Flagship

Kelas

Mid range

SM8350-AC

Nombor model

Hi6260

Qualcomm Snapdragon 888 Plus

Halaman rasmi

HiSilicon Kirin 710

Perbandingan SoC Berkaitan

1

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 8300

2

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 7 Gen 3

3

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 6 Gen 1

4

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 8 Gen 4

5

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 8 Gen 1

6

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 7300

7

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 6300

8

Qualcomm Snapdragon 7 Plus Gen 3 vs Qualcomm Snapdragon 888 Plus

9

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 660

10

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 778G Plus